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1 Analysis of packaging effects on wire bonder made microtransformer chips [会议论文]

作者:Moazenzadeh, A.^1;Moosavi, S.H.^2;Spengler, N.^1;等

关键词:Coefficients of thermal expansions;Electrical performance;...

会议举办机构:Laboratory for Microactuators, Department of Microsystems Engineering (IMTEK), University of Freiburg, Georges-Koehler-Allee 102, 79110 Freiburg, Germany^1

会议时间:

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